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  Silver Solder Clay-Bond Plus 10 gram
Silver Solder Clay-Bond Plus 10 gram


 
Clay-Bond is a silver-containing product used for joining silver, bronze, copper, and brass articles, whether they have been formed from metal clay or stamped sheet. It is a powder that is mixed with water into a paste and then applied to the surfaces to be joined. After firing it forms a strong metallic joint suitable for all jewelry-related applications.
Price: $39.38
Product Dimensions: 10gram Jar
Made in USA
Creative Reward Points you'll earn: 39

Stock Status: In Stock

Product Code: SOL-224
Qty:

Details
 
Use like a paste to bond various metal clay and other metal parts together.

Clay-Bond is used to join 2 flat surfaces and fired in activated carbon.